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HP DV6000 DV9000 Copper Shim Kit For Boards With Dual GPU's
HP DV6000 DV9000 Copper Shim Kit For Boards With Dual GPU's
HP DV6000 DV9000 Copper Shim Kit For Boards With Dual GPU's

HP DV6000 DV9000 Copper Shim Kit For Boards With Dual GPU's

$ 7.89

Availability: 207 in stock
  • Item must be returned within: 30 Days
  • All returns accepted: Returns Accepted
  • Material: Copper
  • Brand: Unbranded/Generic
  • Condition: New
  • Type: Thermal Pad
  • Return shipping will be paid by: Buyer
  • Restocking Fee: No
  • Refund will be given as: Money Back
  • MPN: Does Not Apply

    Description

    HP DV6000 DV9000 Copper Shim Kit For Boards With Dual GPU's
    O
    ver 5000 shim kits sold!
    Be the next to keep your laptop safe from future overheating failure!
    Buy 2 of this item or any 2
    thermal pads
    or
    copper shim kits
    get one of equal or lesser value free!
    (contact me after ordering specifying which extra kit/pad you would like)
    Best offers will not include thermal paste.
    Please note when you make an offer you do not need thermal paste or the offer will be declined.
    Replace the stock thermal pad with a copper shim and upgrade the larger gpu to cool better then stock keeping gpu failure from happening
    Includes
    Larger GPU application
    4x shims for gpu ram chips
    1x .25mm thickness shim for larger gpu
    Small GPU application-Two options
    1x 1.1mm thickness shim-fits most models
    High quality thermal putty/.7mm thickness shim(recommended)*
    Thermal tools
    Enough quality thermal paste for your cpu and gpu's
    Lap/polishing materials for gpu and heastink
    Detailed instructions
    If you are missing the thermal pads for the larger gpu's ram chips I have another auction that includes quality thermal pad material to replace them
    CLICK HERE
    *The stock thermal pad for the smaller gpu on most dv9500 or above, dv6500 or above and intel models varies in size from the most common 1.1mm thickness.  A shim/thermal putty solution is used shown below forming a tight seal for best thermal conductivity.